We Work
To Understand
Your Project Goals and Outputs

Tackling Thermal Challenges in High-Density Computing

With the surge in AI computing demands, CPU/GPU power density continues to rise, pushing air cooling to its limits. Leveraging over 20 years of thermal management expertise, we specialize in delivering precise and efficient liquid cooling solutions for high-power computing chips.


Targeting Server-Grade Cooling Demands

Our solutions precisely address thermal requirements from chips to entire servers. We deliver tailored hardware solutions for both single high-power processors and multi-chip server systems, ensuring computing cores maintain optimal operating conditions.


Walmate AI and supercomputing
liquid cooling solutions
Cold Plate Liquid Cooling Solutions

We provide professional server-grade cold plate liquid cooling structural systems, including high-performance liquid cold plates based on MLCP technology, quick-disconnect connectors, distribution manifolds, and matching installation components to form a complete structural kit.


Core components include: CPU/GPU-specific MLCP liquid cold plates, quick-disconnect connector systems, distribution manifolds and headers, along with system mounting and support structures. This solution supports seamless integration with existing server architectures, featuring easy installation and maintenance while effectively controlling upgrade costs.


With over 20 years of precision manufacturing experience, we ensure each component undergoes rigorous testing, delivering reliable and durable cold plate liquid cooling structural solutions that maintain long-term system stability.


Immersion Cooling Structural System Solutions

We specialize in manufacturing core structural components for immersion cooling systems, delivering complete tank and installation component kits. Our offerings include customized immersion cooling tanks, structural support frames, server trays and rails, sealing covers, fluid ports, and full installation accessories.


Utilizing mature welding processes and rigorous quality inspections, we ensure exceptional sealing performance and structural strength in every tank. All components are designed with full compatibility in mind for rapid customer integration.


As a dedicated structural supplier, we provide robust and reliable foundational support for immersion cooling projects, ensuring long-term operational stability to meet the demanding requirements of high-density computing environments.


Working Principle
of Liquid Cooled Server
Precision Skiving Technology

We employ advanced skiving processes to directly form intricate micro-channel cooling structures from solid copper/aluminum substrates. This technique enables monolithic integration of channels and base plates, ensuring structural integrity and dimensional accuracy. Through optimized channel layout and fin geometry, we achieve enhanced heat exchange efficiency, providing a stable thermal foundation for high-power chips.


Reliable Sealing Welding Technology

We utilize mature welding processes to achieve complete encapsulation of channel systems. Through precise control of welding parameters and procedures, we ensure uniform and dense weld seams with excellent sealing performance and mechanical strength. Our technology pays particular attention to heat-affected zone control, maintaining structural integrity while guaranteeing long-term reliability and stability, ensuring durable operation for liquid cooling systems.