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With the surge in AI computing demands, CPU/GPU power density continues to rise, pushing air cooling to its limits. Leveraging over 20 years of thermal management expertise, we specialize in delivering precise and efficient liquid cooling solutions for high-power computing chips.

Our solutions precisely address thermal requirements from chips to entire servers. We deliver tailored hardware solutions for both single high-power processors and multi-chip server systems, ensuring computing cores maintain optimal operating conditions.

We employ advanced skiving processes to directly form intricate micro-channel cooling structures from solid copper/aluminum substrates. This technique enables monolithic integration of channels and base plates, ensuring structural integrity and dimensional accuracy. Through optimized channel layout and fin geometry, we achieve enhanced heat exchange efficiency, providing a stable thermal foundation for high-power chips.
We utilize mature welding processes to achieve complete encapsulation of channel systems. Through precise control of welding parameters and procedures, we ensure uniform and dense weld seams with excellent sealing performance and mechanical strength. Our technology pays particular attention to heat-affected zone control, maintaining structural integrity while guaranteeing long-term reliability and stability, ensuring durable operation for liquid cooling systems.